Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Copper Oxidation Effect in the EMC/Cu Interfacial Adhesion Improvement for a Novel Copper Interconnection Substrate Application
Copper Oxidation Effect in the EMC/Cu Interfacial Adhesion Improvement for a Novel Copper Interconnection Substrate Application
Shu, Min-Fong, and Yi-Hsiu Tseng. 2018. “Copper Oxidation Effect in the EMC/Cu Interfacial Adhesion Improvement for a Novel Copper Interconnection Substrate Application.” IMAPSource Proceedings 2018 (1): 161–66. https://doi.org/10.4071/2380-4505-2018.1.000161.