Copper Oxidation Effect in the EMC/Cu Interfacial Adhesion Improvement for a Novel Copper Interconnection Substrate Application

Min-Fong Shu; Yi-Hsiu Tseng

doi:10.4071/2380-4505-2018.1.000161

Loading [Contrib]/a11y/accessibility-menu.js

Shu, Min-Fong, and Yi-Hsiu Tseng. 2018. “Copper Oxidation Effect in the EMC/Cu Interfacial Adhesion Improvement for a Novel Copper Interconnection Substrate Application.” IMAPSource Proceedings 2018 (1): 161–66. https://doi.org/10.4071/2380-4505-2018.1.000161.

View more stats