Vol. 2019, Issue 1, 2019October 01, 2019 EDT
On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°C
On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°C
Richter, Jessica, Anna Steenmann, Benjamin Schellscheidt, and Thomas Licht. 2019. “On-Chip Diffusion Bonding Creates Stable Interconnections Usable at Temperatures over 300°C.” IMAPSource Proceedings 2019 (1): 530–34. https://doi.org/10.4071/2380-4505-2019.1.000530.