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Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°C

Jessica Richter, Anna Steenmann, Benjamin Schellscheidt, Thomas Licht,
copper-tin stackdiffusion bondinginterconnection technologiesnano technologiesreliabilitysolderingtransient liquid phase bonding (TLPB)
https://doi.org/10.4071/2380-4505-2019.1.000530
IMAPSource Conference Papers
Richter, Jessica, Anna Steenmann, Benjamin Schellscheidt, and Thomas Licht. 2019. “On-Chip Diffusion Bonding Creates Stable Interconnections Usable at Temperatures over 300°C.” IMAPSource Proceedings 2019 (1): 530–34. https:/​/​doi.org/​10.4071/​2380-4505-2019.1.000530.
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