Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

2.5D Smart Objects Using Thermoplastic Stretchable Interconnects

Bart Plovie, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Bjorn Vandecasteele, Frederick Bossuyt, Jan Vanfleteren,
smart objects thermoforming thermoplastic stretchable one-time deformable
• https://doi.org/10.4071/isom-2015-THP51
IMAPSource Conference Papers
Plovie, Bart, Sheila Dunphy, Kristof Dhaenens, Steven Van Put, Bjorn Vandecasteele, Frederick Bossuyt, and Jan Vanfleteren. 2015. “2.5D Smart Objects Using Thermoplastic Stretchable Interconnects.” IMAPSource Proceedings 2015 (1): 868–73. https://doi.org/10.4071/isom-2015-THP51.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system