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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
A Method to Quickly Measure the Thickness of Aluminum Bond Pad on Silicon Substrate
Son Nguyen
,
Z. Joan Delalic
,
Horst Clauberg
,
wire bonding
EDS
Al pad measurement
•
https://doi.org/10.4071/isom-2010-WP4-Paper6
IMAPSource Conference Papers
Nguyen, Son, Z. Joan Delalic, and Horst Clauberg. 2010. “A Method to Quickly Measure the Thickness of Aluminum Bond Pad on Silicon Substrate.”
IMAPSource Proceedings
2010 (1): 682–86.
https://doi.org/10.4071/isom-2010-WP4-Paper6
.
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