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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules

Adam Morgan, Xin Zhao, Jason Rouse, Douglas Hopkins,
Silicone Gel Encapsulation Leakage Current High Temperature Wide-bandgap Device Packaging Power Module
• https://doi.org/10.4071/isom-2017-WA54_099
IMAPSource Conference Papers
Morgan, Adam, Xin Zhao, Jason Rouse, and Douglas Hopkins. 2017. “Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power Modules.” IMAPSource Proceedings 2017 (1): 312–17. https://doi.org/10.4071/isom-2017-WA54_099.
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