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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Effects of Sb and Zn Addition on Impact Resistance Improvement of Sn-Bi Solder Joints
Keishiro Okamoto
,
Kenji Nomura
,
Shuichi Doi
,
Toshiya Akamatsu
,
Seiki Sakuyama
,
Keisuke Uenishi
,
Drop impact resistance
intermetallic compound
Sn-Bi eutectic solder
Sn-Bi-Sb-Zn solder
•
https://doi.org/10.4071/isom-2013-TA42
IMAPSource Conference Papers
Okamoto, Keishiro, Kenji Nomura, Shuichi Doi, Toshiya Akamatsu, Seiki Sakuyama, and Keisuke Uenishi. 2013. “Effects of Sb and Zn Addition on Impact Resistance Improvement of Sn-Bi Solder Joints.”
IMAPSource Proceedings
2013 (1): 104–8.
https://doi.org/10.4071/isom-2013-TA42
.
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