Reliability of PCB Solder Joints Assembled with SACm™ Solder Paste

Arnab Dasgupta; Fengying Zhou; Christine LaBarbera; Weiping Liu; Paul Bachorik; Ning-Cheng Lee

doi:10.4071/isom-TP65

Dasgupta, Arnab, Fengying Zhou, Christine LaBarbera, Weiping Liu, Paul Bachorik, and Ning-Cheng Lee. 2014. “Reliability of PCB Solder Joints Assembled with SACm^TM Solder Paste.” IMAPSource Proceedings 2014 (1): 367–73. https://doi.org/10.4071/isom-TP65.

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