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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
High viscosity paste dosing for microelectronic applications
T. Thomas
,
S. Voges
,
T. Braun
,
S. Raatz
,
R. Kahle
,
K.-F. Becker
,
M. Koch
,
M. Fliess
,
J. Bauer
,
M. Schneider-Ramelow
,
K.-D. Lang
,
Material deposition
liquid mold compound [LMC]
glob top
encapsulant
rheology
•
https://doi.org/10.4071/isom-2016-WP45
IMAPSource Conference Papers
Thomas, T., S. Voges, T. Braun, S. Raatz, R. Kahle, K.-F. Becker, M. Koch, et al. 2016. “High Viscosity Paste Dosing for Microelectronic Applications.”
IMAPSource Proceedings
2016 (1): 345–50.
https://doi.org/10.4071/isom-2016-WP45
.
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