ISSN 2380-4505
Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Through Silicon Vias and Holes Metallization using CoWP and Cu Nanoparticles as Barrier and Seed Layers
Through Silicon Vias and Holes Metallization using CoWP and Cu Nanoparticles as Barrier and Seed Layers
Dow, Wei-Ping, Shao-Ping Shen, Chun-Wei Lu, Yiu-Hsiang Chang, Motonobu Kubo, Tohru Kamitamari, Eric Cheng, Jing-Yuan Lin, and Fu-Chiang Hsu. 2011. “Through Silicon Vias and Holes Metallization Using CoWP and Cu Nanoparticles as Barrier and Seed Layers.” IMAPSource Proceedings 2011 (1): 645–49. https://doi.org/10.4071/isom-2011-WA6-Paper1.