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Symposium Proceedings
Vol. 2011, Issue 1, 2011January 01, 2011 EDT

Through Silicon Vias and Holes Metallization using CoWP and Cu Nanoparticles as Barrier and Seed Layers

Wei-Ping Dow, Shao-Ping Shen, Chun-Wei Lu, Yiu-Hsiang Chang, Motonobu Kubo, Tohru Kamitamari, Eric Cheng, Jing-Yuan Lin, Fu-Chiang Hsu,
Through Silicon ViasTSVHolesMetallizationCoWPCu NanoparticlesBarrier layerSeed LayerTSHCuNPSCF
https://doi.org/10.4071/isom-2011-WA6-Paper1
IMAPSource Conference Papers
Dow, Wei-Ping, Shao-Ping Shen, Chun-Wei Lu, Yiu-Hsiang Chang, Motonobu Kubo, Tohru Kamitamari, Eric Cheng, Jing-Yuan Lin, and Fu-Chiang Hsu. 2011. “Through Silicon Vias and Holes Metallization Using CoWP and Cu Nanoparticles as Barrier and Seed Layers.” IMAPSource Proceedings 2011 (1): 645–49. https:/​/​doi.org/​10.4071/​isom-2011-WA6-Paper1.
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