Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Through Silicon Vias and Holes Metallization using CoWP and Cu Nanoparticles as Barrier and Seed Layers
Through Silicon Vias and Holes Metallization using CoWP and Cu Nanoparticles as Barrier and Seed Layers
Wei-Ping Dow, Shao-Ping Shen, Chun-Wei Lu, Yiu-Hsiang Chang, Motonobu Kubo, Tohru Kamitamari, Eric Cheng, Jing-Yuan Lin, Fu-Chiang Hsu,
Dow, Wei-Ping, Shao-Ping Shen, Chun-Wei Lu, Yiu-Hsiang Chang, Motonobu Kubo, Tohru Kamitamari, Eric Cheng, Jing-Yuan Lin, and Fu-Chiang Hsu. 2011. “Through Silicon Vias and Holes Metallization Using CoWP and Cu Nanoparticles as Barrier and Seed Layers.” IMAPSource Proceedings 2011 (1): 645–49. https://doi.org/10.4071/isom-2011-WA6-Paper1.
Powered by Scholastica, the modern academic journal management system