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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Multi Beam Full Cut Dicing of Thin Si IC wafers
Jeroen van Borkulo
,
Richard van der Stam
,
Won Chul Jung
,
Paul Verburg
,
3D packaging
dicing
die strength
laser
thin wafer
multiple beam
•
https://doi.org/10.4071/isom-2015-WP52
IMAPSource Conference Papers
Borkulo, Jeroen van, Richard van der Stam, Won Chul Jung, and Paul Verburg. 2015. “Multi Beam Full Cut Dicing of Thin Si IC Wafers.”
IMAPSource Proceedings
2015 (1): 474–78.
https://doi.org/10.4071/isom-2015-WP52
.
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