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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
New Flip-Chip Interconnect Technology for High Performance and High Reliability Applications
Eiji Yamaguchi
,
Mutsuo Tsuji
,
Nozomi Shimoishizaka
,
Takahiro Nakano
,
Katsunori Hirata
,
Flip chip
Conductive Paste
Low-K
Ceramic Substrate
High Performance
Reliability
•
https://doi.org/10.4071/isom-2012-TP64
IMAPSource Conference Papers
Yamaguchi, Eiji, Mutsuo Tsuji, Nozomi Shimoishizaka, Takahiro Nakano, and Katsunori Hirata. 2012. “New Flip-Chip Interconnect Technology for High Performance and High Reliability Applications.”
IMAPSource Proceedings
2012 (1): 482–90.
https://doi.org/10.4071/isom-2012-TP64
.
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