Vol. 2012, Issue 1, 2012January 01, 2012 EDT
New Flip-Chip Interconnect Technology for High Performance and High Reliability Applications
New Flip-Chip Interconnect Technology for High Performance and High Reliability Applications
Yamaguchi, Eiji, Mutsuo Tsuji, Nozomi Shimoishizaka, Takahiro Nakano, and Katsunori Hirata. 2012. “New Flip-Chip Interconnect Technology for High Performance and High Reliability Applications.” IMAPSource Proceedings 2012 (1): 482–90. https://doi.org/10.4071/isom-2012-TP64.