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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

160 MILLI-OHM ELECTRICAL RESISTANCE THRU-WAFER INTERCONNECTS WITH 10:1 ASPECT RATIO

A. Efimovskaya, A.M. Shkel,
through wafer via 3d interconnect MEMS and IC integration wafer level packaging folded TIMU
• https://doi.org/10.4071/isom-WA51
IMAPSource Conference Papers
Efimovskaya, A., and A.M. Shkel. 2014. “160 MILLI-OHM ELECTRICAL RESISTANCE THRU-WAFER INTERCONNECTS WITH 10:1 ASPECT RATIO.” IMAPSource Proceedings 2014 (1): 505–10. https://doi.org/10.4071/isom-WA51.
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