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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
160 MILLI-OHM ELECTRICAL RESISTANCE THRU-WAFER INTERCONNECTS WITH 10:1 ASPECT RATIO
A. Efimovskaya
,
A.M. Shkel
,
through wafer via
3d interconnect
MEMS and IC integration
wafer level packaging
folded TIMU
•
https://doi.org/10.4071/isom-WA51
IMAPSource Conference Papers
Efimovskaya, A., and A.M. Shkel. 2014. “160 MILLI-OHM ELECTRICAL RESISTANCE THRU-WAFER INTERCONNECTS WITH 10:1 ASPECT RATIO.”
IMAPSource Proceedings
2014 (1): 505–10.
https://doi.org/10.4071/isom-WA51
.
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