Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Novel Backside Grinding and Laser Dicing Process for Cu Pillar Generated Low-k Wafer
Novel Backside Grinding and Laser Dicing Process for Cu Pillar Generated Low-k Wafer
Tamadate, Yuka, Hideki Maruyama, Katsunori Aoki, Takashi Ozawa, and Haruo Sorimachi. 2013. “Novel Backside Grinding and Laser Dicing Process for Cu Pillar Generated Low-k Wafer.” IMAPSource Proceedings 2013 (1): 1–4. https://doi.org/10.4071/isom-2013-WP54_Shinko_LATE.