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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Advances in Wire Bonding Technology for Different Bonding Wire Material

Ivy Qin, Aashish Shah, Hui Xu, Bob Chylak, Nelson Wong,
Wire BondingCopper Wire BondingSilver Wire BondingCost ReductionReliability
https://doi.org/10.4071/isom-2015-WP33
IMAPSource Conference Papers
Qin, Ivy, Aashish Shah, Hui Xu, Bob Chylak, and Nelson Wong. 2015. “Advances in Wire Bonding Technology for Different Bonding Wire Material.” IMAPSource Proceedings 2015 (1): 406–12. https:/​/​doi.org/​10.4071/​isom-2015-WP33.
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