Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Temporary Bonding and Debonding Technologies to Enable Innovative Fan-Out Embedded Interposer for High-Density Applications
Temporary Bonding and Debonding Technologies to Enable Innovative Fan-Out Embedded Interposer for High-Density Applications
Lee, Alvin, Jay Su, Xiao Liu, Yin-Po Hung, Yu-Min Lin, Shin-Yi Huang, Ren-Shin Cheng, and Tao-Chih Chang. 2015. “Temporary Bonding and Debonding Technologies to Enable Innovative Fan-Out Embedded Interposer for High-Density Applications.” IMAPSource Proceedings 2015 (1): 1–6. https://doi.org/10.4071/isom-2015-THA21.