Low temperature wafer level packaging technology of bulk-micromachined MEMS device

Heung Woo Park; Seung Hun Han; Hyun Kee Lee; Yeong Gyu Lee; Seoung Ho Kim; Bok Gun Moon; Taek Hee Yun; Min Seok Jang; Si Joong Yang; Sang Hun Park; Sung Jun Lee; Won Kyu Jeung; Jung Won Lee

doi:10.4071/isom-2010-WP5-paper2

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Park, Heung Woo, Seung Hun Han, Hyun Kee Lee, Yeong Gyu Lee, Seoung Ho Kim, Bok Gun Moon, Taek Hee Yun, et al. 2010. “Low Temperature Wafer Level Packaging Technology of Bulk-Micromachined MEMS Device.” IMAPSource Proceedings 2010 (1): 695–702. https://doi.org/10.4071/isom-2010-WP5-paper2.

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