Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
Highly Flexible Die Attach Adhesives for MEMS packages
Tobias Königer
,
Adhesives
MEMS packaging
stress
die attach
adhesive bonding
•
https://doi.org/10.4071/isom-2012-THP51
IMAPSource Conference Papers
Königer, Tobias. 2012. “Highly Flexible Die Attach Adhesives for MEMS Packages.”
IMAPSource Proceedings
2012 (1): 1169–77.
https://doi.org/10.4071/isom-2012-THP51
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats
