Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Ferrites in Transfer Molded Power SiPs – Challenges in Packaging
Ferrites in Transfer Molded Power SiPs – Challenges in Packaging
Thomas, Tina, Marius van Dijk, Marc Dreissigacker, Stefan Hoffmann, Hans Walter, Karl-Friedrich Becker, and Martin Schneider-Ramelow. 2019. “Ferrites in Transfer Molded Power SiPs – Challenges in Packaging.” IMAPSource Proceedings 2019 (1): 19–26. https://doi.org/10.4071/2380-4505-2019.1.000019.