Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:39802/feed
Symposium Proceedings
Vol. 2016, Issue S2, 2016October 01, 2016 EDT

Chip Package Interaction Considerations in Fan-out Wafer Level Packaging

Urmi Ray,
Chip Package interactionCPIFOWLP
https://doi.org/10.4071/isom-2016-slide-7
IMAPSource Conference Papers
Ray, Urmi. 2016. “Chip Package Interaction Considerations in Fan-out Wafer Level Packaging.” IMAPSource Proceedings 2016 (S2): S1–13. https:/​/​doi.org/​10.4071/​isom-2016-slide-7.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system