Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:26648/feed
Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Ag wire and Ag alloy wire reliability and molding compounds

Aya Mizushima, Shinichiro Kato, Hidenori Abe, Naoki Sadayori, Yoshinori Endo, Kazuhiko Yasuhara, Jun Chiba, Tomio Iwasaki,
molding compoundcorrosionAg wireion impurityion mobilitysimulation
https://doi.org/10.4071/isom-2013-TA23
IMAPSource Conference Papers
Mizushima, Aya, Shinichiro Kato, Hidenori Abe, Naoki Sadayori, Yoshinori Endo, Kazuhiko Yasuhara, Jun Chiba, and Tomio Iwasaki. 2013. “Ag Wire and Ag Alloy Wire Reliability and Molding Compounds.” IMAPSource Proceedings 2013 (1): 45–49. https:/​/​doi.org/​10.4071/​isom-2013-TA23.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system