Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2011, Issue 1, 2011January 01, 2011 EDT

IC Bond Pad Structural Study by “Ripple Effect”

Jose Martinez, Cesar Salas, Marco Salas, Jason Schofield, Steven Sheffield, Kyle Wilkins, Stevan Hunter,
bond pad BOAC cracks ripple deformation
• https://doi.org/10.4071/isom-2011-WA2-Paper1
IMAPSource Conference Papers
Martinez, Jose, Cesar Salas, Marco Salas, Jason Schofield, Steven Sheffield, Kyle Wilkins, and Stevan Hunter. 2011. “IC Bond Pad Structural Study by ‘Ripple Effect.’” IMAPSource Proceedings 2011 (1): 491–501. https://doi.org/10.4071/isom-2011-WA2-Paper1.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system