Vol. 2011, Issue 1, 2011January 01, 2011 EDT
IC Bond Pad Structural Study by “Ripple Effect”
IC Bond Pad Structural Study by “Ripple Effect”
Martinez, Jose, Cesar Salas, Marco Salas, Jason Schofield, Steven Sheffield, Kyle Wilkins, and Stevan Hunter. 2011. “IC Bond Pad Structural Study by ‘Ripple Effect.’” IMAPSource Proceedings 2011 (1): 491–501. https://doi.org/10.4071/isom-2011-WA2-Paper1.