Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Advanced Thermal Study of Very High Power TSV Interposer and Interconnects for 28nm Technology FPGA
Advanced Thermal Study of Very High Power TSV Interposer and Interconnects for 28nm Technology FPGA
Banijamali, Bahareh, Suresh Ramalingam, and Raghunandan Chaware. 2011. “Advanced Thermal Study of Very High Power TSV Interposer and Interconnects for 28nm Technology FPGA.” IMAPSource Proceedings 2011 (1): 665–68. https://doi.org/10.4071/isom-2011-WP1-Paper2.