Challenges in 3D Inspection of Micro Bumps Used in 3D Packaging

Reza Asgari

doi:10.4071/isom-2012-WA12

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Asgari, Reza. 2012. “Challenges in 3D Inspection of Micro Bumps Used in 3D Packaging.” IMAPSource Proceedings 2012 (1): 542–47. https://doi.org/10.4071/isom-2012-WA12.

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