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Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm
Thomas Oppert
,
Rainer Dohle
,
Jörg Franke
,
Stefan Härter
,
Solder Sphere Transfer
Solder Jetting
Flip Chip
Fine-Pitch
Long-Term Reliability
•
https://doi.org/10.4071/isom-2011-THA3-Paper1
IMAPSource Conference Papers
Oppert, Thomas, Rainer Dohle, Jörg Franke, and Stefan Härter. 2011. “Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm.”
IMAPSource Proceedings
2011 (1): 953–60.
https://doi.org/10.4071/isom-2011-THA3-Paper1
.
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