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Symposium Proceedings
Vol. 2011, Issue 1, 2011January 01, 2011 EDT

Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm

Thomas Oppert, Rainer Dohle, Jörg Franke, Stefan Härter,
Solder Sphere Transfer Solder Jetting Flip Chip Fine-Pitch Long-Term Reliability
• https://doi.org/10.4071/isom-2011-THA3-Paper1
IMAPSource Conference Papers
Oppert, Thomas, Rainer Dohle, Jörg Franke, and Stefan Härter. 2011. “Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm.” IMAPSource Proceedings 2011 (1): 953–60. https://doi.org/10.4071/isom-2011-THA3-Paper1.
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