Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm
Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm
Oppert, Thomas, Rainer Dohle, Jörg Franke, and Stefan Härter. 2011. “Wafer Level Solder Bumping and Flip Chip Assembly with Solder Balls Down to 30μm.” IMAPSource Proceedings 2011 (1): 953–60. https://doi.org/10.4071/isom-2011-THA3-Paper1.
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