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Symposium Proceedings
Vol. 2020, Issue 1, 2020
September 01, 2020 EDT
Heterogeneous System-In-Package (HSIP) Technology
Charles Woychik
,
Robert Mundella
,
Keith Kunard
,
Victor Vilar
,
Justin Borski
,
Robert Nead
,
Fan-out Wafer-level Packaging (FOWLP)
Hetergeneous system-in-package (HSIP)
Buildup package
•
https://doi.org/10.4071/2380-4505-2020.1.000034
IMAPSource Conference Papers
Woychik, Charles, Robert Mundella, Keith Kunard, Victor Vilar, Justin Borski, and Robert Nead. 2020. “Heterogeneous System-In-Package (HSIP) Technology.”
IMAPSource Proceedings
2020 (1): 34–41.
https://doi.org/10.4071/2380-4505-2020.1.000034
.
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