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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Measuring Die Tilt Using Shadow Moiré Optical Measurements; New Techniques for Discontinuous and Semi-Reflective Surfaces

Neil Hubble,
3D packaging Die Tilt Flip Chip Warpage
• https://doi.org/10.4071/isom-2016-THP34
IMAPSource Conference Papers
Hubble, Neil. 2016. “Measuring Die Tilt Using Shadow Moiré Optical Measurements; New Techniques for Discontinuous and Semi-Reflective Surfaces.” IMAPSource Proceedings 2016 (1): 612–17. https://doi.org/10.4071/isom-2016-THP34.
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