Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Measuring Die Tilt Using Shadow Moiré Optical Measurements; New Techniques for Discontinuous and Semi-Reflective Surfaces
Neil Hubble
,
3D packaging
Die Tilt
Flip Chip
Warpage
•
https://doi.org/10.4071/isom-2016-THP34
IMAPSource Conference Papers
Hubble, Neil. 2016. “Measuring Die Tilt Using Shadow Moiré Optical Measurements; New Techniques for Discontinuous and Semi-Reflective Surfaces.”
IMAPSource Proceedings
2016 (1): 612–17.
https://doi.org/10.4071/isom-2016-THP34
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats