Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Using In situ Capacitance Measurements to Monitor the Stability of Thermal Interface Materials in Complex PCB Assemblies
Using In situ Capacitance Measurements to Monitor the Stability of Thermal Interface Materials in Complex PCB Assemblies
Gaynes, Michael, Timothy Chainer, Edward Yarmchuk, John Torok, David Edwards, David Olson, and Katie Pizzolato. 2010. “Using In Situ Capacitance Measurements to Monitor the Stability of Thermal Interface Materials in Complex PCB Assemblies.” IMAPSource Proceedings 2010 (1): 450–57. https://doi.org/10.4071/isom-2010-WA3-Paper4.
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