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Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Process Development of Al-alloy Wire Bonding for High-Temperature Power Electronics
Xuan Che
,
Tao Xu
,
Jason Fu
,
Omid Niayesh
,
Al-alloy wire
IGBT
power electronics
2N-Al wire
Automotive
Mechanical strength
•
https://doi.org/10.4071/2380-4505-2018.1.000566
IMAPSource Conference Papers
Che, Xuan, Tao Xu, Jason Fu, and Omid Niayesh. 2018. “Process Development of Al-Alloy Wire Bonding for High-Temperature Power Electronics.”
IMAPSource Proceedings
2018 (1): 566–71.
https://doi.org/10.4071/2380-4505-2018.1.000566
.
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