Process Development of Al-alloy Wire Bonding for High-Temperature Power Electronics

Xuan Che; Tao Xu; Jason Fu; Omid Niayesh

doi:10.4071/2380-4505-2018.1.000566

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Che, Xuan, Tao Xu, Jason Fu, and Omid Niayesh. 2018. “Process Development of Al-Alloy Wire Bonding for High-Temperature Power Electronics.” IMAPSource Proceedings 2018 (1): 566–71. https://doi.org/10.4071/2380-4505-2018.1.000566.

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