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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Fan-in WLP: Technology and Market Trends
A. Ivankovic
,
T. Buisson
,
S. Kumar
,
A. Pizzagalli
,
J. Azemar
,
R. Beica
,
fan-in
wafer level packaging
forecast
roadmap
cost and investment
Internet of Things
•
https://doi.org/10.4071/isom-2015-TP31
IMAPSource Conference Papers
Ivankovic, A., T. Buisson, S. Kumar, A. Pizzagalli, J. Azemar, and R. Beica. 2015. “Fan-in WLP: Technology and Market Trends.”
IMAPSource Proceedings
2015 (1): 67–72.
https://doi.org/10.4071/isom-2015-TP31
.
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