Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Packaging Induced Die Stress Characterization Using van der Pauw Sensors Between −180°C and 80°C
Packaging Induced Die Stress Characterization Using van der Pauw Sensors Between −180°C and 80°C
Goteti, Uday S., Francy J. Akkara, Richard C. Jaeger, Michael C. Hamilton, and Jeffrey C. Suhling. 2014. “Packaging Induced Die Stress Characterization Using van Der Pauw Sensors Between −180°C and 80°C.” IMAPSource Proceedings 2014 (1): 483–87. https://doi.org/10.4071/isom-WA43.
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