Thermoplastic Optical Polymers with Lead-Free Solder Reflow Resistance for HB-LED Packaging and Assembly

Weijun Zhou; Quan Yuan; Chris Li; Stephen F. Hahn; Kurt A. Koppi; Berend Hoek

doi:10.4071/isom-2010-TA5-Paper4

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Zhou, Weijun, Quan Yuan, Chris Li, Stephen F. Hahn, Kurt A. Koppi, and Berend Hoek. 2010. “Thermoplastic Optical Polymers with Lead-Free Solder Reflow Resistance for HB-LED Packaging and Assembly.” IMAPSource Proceedings 2010 (1): 156–63. https://doi.org/10.4071/isom-2010-TA5-Paper4.

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