Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Thermoplastic Optical Polymers with Lead-Free Solder Reflow Resistance for HB-LED Packaging and Assembly
Thermoplastic Optical Polymers with Lead-Free Solder Reflow Resistance for HB-LED Packaging and Assembly
Zhou, Weijun, Quan Yuan, Chris Li, Stephen F. Hahn, Kurt A. Koppi, and Berend Hoek. 2010. “Thermoplastic Optical Polymers with Lead-Free Solder Reflow Resistance for HB-LED Packaging and Assembly.” IMAPSource Proceedings 2010 (1): 156–63. https://doi.org/10.4071/isom-2010-TA5-Paper4.