Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Heterogeneous Integration of a 300mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-last 3D Interconnection
Heterogeneous Integration of a 300mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-last 3D Interconnection
McDonough, Colin, Doug La Tulipe, Dan Pascual, Paul Tariello, John Mucci, Matt Smalley, Anh Nguyen, et al. 2015. “Heterogeneous Integration of a 300mm Silicon Photonics-CMOS Wafer Stack by Direct Oxide Bonding and Via-Last 3D Interconnection.” IMAPSource Proceedings 2015 (1): 621–26. https://doi.org/10.4071/isom-2015-THA35.
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