High via density thin metal-core PCB using electro-coated dielectric

Bernd Scholz; Ismir Pekmic; Syed Sajid Ahmad; Aaron Reinholz

doi:10.4071/isom-2010-WP3-Paper2

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Scholz, Bernd, Ismir Pekmic, Syed Sajid Ahmad, and Aaron Reinholz. 2010. “High via Density Thin Metal-Core PCB Using Electro-Coated Dielectric.” IMAPSource Proceedings 2010 (1): 615–21. https://doi.org/10.4071/isom-2010-WP3-Paper2.

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