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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
High via density thin metal-core PCB using electro-coated dielectric
Bernd Scholz
,
Ismir Pekmic
,
Syed Sajid Ahmad
,
Aaron Reinholz
,
High density via
Metal core PCB
electro coating
dielectric
package substrates
heat dissipation
chemical etching
RF
•
https://doi.org/10.4071/isom-2010-WP3-Paper2
IMAPSource Conference Papers
Scholz, Bernd, Ismir Pekmic, Syed Sajid Ahmad, and Aaron Reinholz. 2010. “High via Density Thin Metal-Core PCB Using Electro-Coated Dielectric.”
IMAPSource Proceedings
2010 (1): 615–21.
https://doi.org/10.4071/isom-2010-WP3-Paper2
.
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