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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

High via density thin metal-core PCB using electro-coated dielectric

Bernd Scholz, Ismir Pekmic, Syed Sajid Ahmad, Aaron Reinholz,
High density via Metal core PCB electro coating dielectric package substrates heat dissipation chemical etching RF
• https://doi.org/10.4071/isom-2010-WP3-Paper2
IMAPSource Conference Papers
Scholz, Bernd, Ismir Pekmic, Syed Sajid Ahmad, and Aaron Reinholz. 2010. “High via Density Thin Metal-Core PCB Using Electro-Coated Dielectric.” IMAPSource Proceedings 2010 (1): 615–21. https://doi.org/10.4071/isom-2010-WP3-Paper2.
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