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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

Spin Coating of Dielectrics on Thin Silicon To Enhance Strength Characteristics

Fred Haring, Syed Sajid Ahmad, Nathan Schneck, Kaycie Gerstner, Nicole Dallman, Chris Hoffarth, Aaron Reinholz,
Thin wafer handling thin die handling thin wafer thin die handling wafer stiffening die stiffening
• https://doi.org/10.4071/isom-2010-TP5-Paper3
IMAPSource Conference Papers
Haring, Fred, Syed Sajid Ahmad, Nathan Schneck, Kaycie Gerstner, Nicole Dallman, Chris Hoffarth, and Aaron Reinholz. 2010. “Spin Coating of Dielectrics on Thin Silicon To Enhance Strength Characteristics.” IMAPSource Proceedings 2010 (1): 339–43. https://doi.org/10.4071/isom-2010-TP5-Paper3.
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