Wedge Bond Process Optimization Method for 1.5 mil Al Wire on Al Bond Pad

Wenjuan Qi; Daniel D. Evans

doi:10.4071/isom-2015-WP34

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Qi, Wenjuan, and Daniel D. Evans. 2015. “Wedge Bond Process Optimization Method for 1.5 Mil Al Wire on Al Bond Pad.” IMAPSource Proceedings 2015 (1): 413–18. https://doi.org/10.4071/isom-2015-WP34.

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