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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Wedge Bond Process Optimization Method for 1.5 mil Al Wire on Al Bond Pad
Wenjuan Qi
,
Daniel D. Evans
,
Ultrasonic Wedge Bond
Aluminum Wedge Bond
Pad Interaction
Process Optimization
•
https://doi.org/10.4071/isom-2015-WP34
IMAPSource Conference Papers
Qi, Wenjuan, and Daniel D. Evans. 2015. “Wedge Bond Process Optimization Method for 1.5 Mil Al Wire on Al Bond Pad.”
IMAPSource Proceedings
2015 (1): 413–18.
https://doi.org/10.4071/isom-2015-WP34
.
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