Vol. 2020, Issue 1, 2020September 01, 2020 EDT
A novel approach to mitigate stress induced defects at metal-dielectric interface in Redistribution layers for 3D IC stacking
A novel approach to mitigate stress induced defects at metal-dielectric interface in Redistribution layers for 3D IC stacking
Kumar, Amit, Jose Chacon, Peter Gelzinis, Julio Morris, and Ankineedu Velaga. 2020. “A Novel Approach to Mitigate Stress Induced Defects at Metal-Dielectric Interface in Redistribution Layers for 3D IC Stacking.” IMAPSource Proceedings 2020 (1): 131–34. https://doi.org/10.4071/2380-4505-2020.1.000131.