High Aspect Ratio Bumping Process with Solder Bumps Included Sintered Pillars

S. Nakagawa; T. Yasoshima; H. Uno; M. Ishikawa

doi:10.4071/isom-2016-WA24

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Nakagawa, S., T. Yasoshima, H. Uno, and M. Ishikawa. 2016. “High Aspect Ratio Bumping Process with Solder Bumps Included Sintered Pillars.” IMAPSource Proceedings 2016 (1): 171–75. https://doi.org/10.4071/isom-2016-WA24.

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