ISSN 2380-4505
Vol. 2016, Issue 1, 2016October 01, 2016 EDT
High Aspect Ratio Bumping Process with Solder Bumps Included Sintered Pillars
High Aspect Ratio Bumping Process with Solder Bumps Included Sintered Pillars
Nakagawa, S., T. Yasoshima, H. Uno, and M. Ishikawa. 2016. “High Aspect Ratio Bumping Process with Solder Bumps Included Sintered Pillars.” IMAPSource Proceedings 2016 (1): 171–75. https://doi.org/10.4071/isom-2016-WA24.