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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
High Aspect Ratio Bumping Process with Solder Bumps Included Sintered Pillars
S. Nakagawa
,
T. Yasoshima
,
H. Uno
,
M. Ishikawa
,
Solder paste
Fine pitch bumping
High aspect ratio bumps
The transient liquid phase sintering
•
https://doi.org/10.4071/isom-2016-WA24
IMAPSource Conference Papers
Nakagawa, S., T. Yasoshima, H. Uno, and M. Ishikawa. 2016. “High Aspect Ratio Bumping Process with Solder Bumps Included Sintered Pillars.”
IMAPSource Proceedings
2016 (1): 171–75.
https://doi.org/10.4071/isom-2016-WA24
.
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