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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Towards 200mm 3D RF interposer technology

Philippe Soussan, Kristof Vaesen, Bart Vereecke, Jian Zhu,
Interposer High Resistivity Silicon Integrated Passive devices Through Silicon Vias
• https://doi.org/10.4071/isom-2015-TP25
IMAPSource Conference Papers
Soussan, Philippe, Kristof Vaesen, Bart Vereecke, and Jian Zhu. 2015. “Towards 200mm 3D RF Interposer Technology.” IMAPSource Proceedings 2015 (1): 55–61. https://doi.org/10.4071/isom-2015-TP25.
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