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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Towards 200mm 3D RF interposer technology
Philippe Soussan
,
Kristof Vaesen
,
Bart Vereecke
,
Jian Zhu
,
Interposer
High Resistivity Silicon
Integrated Passive devices
Through Silicon Vias
•
https://doi.org/10.4071/isom-2015-TP25
IMAPSource Conference Papers
Soussan, Philippe, Kristof Vaesen, Bart Vereecke, and Jian Zhu. 2015. “Towards 200mm 3D RF Interposer Technology.”
IMAPSource Proceedings
2015 (1): 55–61.
https://doi.org/10.4071/isom-2015-TP25
.
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