Mask and mask-less injection molded solder (IMS) technology for fine pitch substrate bumping

Jae-Woong Nah; Peter A. Gruber; Paul A. Lauro; Claudius Feger

doi:10.4071/isom-2010-TP5-Paper5

Loading [Contrib]/a11y/accessibility-menu.js

Nah, Jae-Woong, Peter A. Gruber, Paul A. Lauro, and Claudius Feger. 2010. “Mask and Mask-Less Injection Molded Solder (IMS) Technology for Fine Pitch Substrate Bumping.” IMAPSource Proceedings 2010 (1): 348–54. https://doi.org/10.4071/isom-2010-TP5-Paper5.

View more stats