Scallop Free Si Etching and Low Cost Integration Technologies for 2.5D Si Interposer.

Yasuhiro Morikawa; Takahide Murayama; Toshiyuki Sakuishi; Toshiyuki Nakamura; Takashi Kurimoto; Yuu Nakamuta; Isao Kimura; Koukou Suu

doi:10.4071/isom-2012-WP65

Morikawa, Yasuhiro, Takahide Murayama, Toshiyuki Sakuishi, Toshiyuki Nakamura, Takashi Kurimoto, Yuu Nakamuta, Isao Kimura, and Koukou Suu. 2012. “Scallop Free Si Etching and Low Cost Integration Technologies for 2.5D Si Interposer.” IMAPSource Proceedings 2012 (1): 998–1000. https://doi.org/10.4071/isom-2012-WP65.

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