Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Scallop Free Si Etching and Low Cost Integration Technologies for 2.5D Si Interposer.
Scallop Free Si Etching and Low Cost Integration Technologies for 2.5D Si Interposer.
Morikawa, Yasuhiro, Takahide Murayama, Toshiyuki Sakuishi, Toshiyuki Nakamura, Takashi Kurimoto, Yuu Nakamuta, Isao Kimura, and Koukou Suu. 2012. “Scallop Free Si Etching and Low Cost Integration Technologies for 2.5D Si Interposer.” IMAPSource Proceedings 2012 (1): 998–1000. https://doi.org/10.4071/isom-2012-WP65.