Adhesive Enhancement Technology for Directly Metal Plating on EMC

Kenichiroh Mukai; Kwonil Kim; Brian Eastep; Lee Gaherty; Anirudh Kashyap

doi:10.4071/isom-TA64

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Mukai, Kenichiroh, Kwonil Kim, Brian Eastep, Lee Gaherty, and Anirudh Kashyap. 2014. “Adhesive Enhancement Technology for Directly Metal Plating on EMC.” IMAPSource Proceedings 2014 (1): 170–77. https://doi.org/10.4071/isom-TA64.

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