Vol. 2019, Issue 1, 2019October 01, 2019 EDT
A High Performance Full SiC Power Module Based On a Novel Stacked DBCs Hybrid Packaging Structure
A High Performance Full SiC Power Module Based On a Novel Stacked DBCs Hybrid Packaging Structure
Wang, Zhiwei, Chi Zhang, Zhizhao Huang, Cai Chen, and Fang Luo. 2019. “A High Performance Full SiC Power Module Based On a Novel Stacked DBCs Hybrid Packaging Structure.” IMAPSource Proceedings 2019 (1): 557–62. https://doi.org/10.4071/2380-4505-2019.1.000557.