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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Eric Ouyang, MyoungSu Chae, Seng Guan Chow, Roger Emigh, Mukul Joshi, Rob Martin, Raj Pendse,
ELKflip chipsolder bumpcopper columnC6Bonded-on-Lead
https://doi.org/10.4071/isom-2010-TP2-Paper1
IMAPSource Conference Papers
Ouyang, Eric, MyoungSu Chae, Seng Guan Chow, Roger Emigh, Mukul Joshi, Rob Martin, and Raj Pendse. 2010. “Improvement of ELK Reliability in Flip Chip Packages Using Bond-on-Lead (BOL) Interconnect Structure.” IMAPSource Proceedings 2010 (1): 197–203. https:/​/​doi.org/​10.4071/​isom-2010-TP2-Paper1.
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