Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Eric Ouyang; MyoungSu Chae; Seng Guan Chow; Roger Emigh; Mukul Joshi; Rob Martin; Raj Pendse

doi:10.4071/isom-2010-TP2-Paper1

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Ouyang, Eric, MyoungSu Chae, Seng Guan Chow, Roger Emigh, Mukul Joshi, Rob Martin, and Raj Pendse. 2010. “Improvement of ELK Reliability in Flip Chip Packages Using Bond-on-Lead (BOL) Interconnect Structure.” IMAPSource Proceedings 2010 (1): 197–203. https://doi.org/10.4071/isom-2010-TP2-Paper1.

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