Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure
Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure
Ouyang, Eric, MyoungSu Chae, Seng Guan Chow, Roger Emigh, Mukul Joshi, Rob Martin, and Raj Pendse. 2010. “Improvement of ELK Reliability in Flip Chip Packages Using Bond-on-Lead (BOL) Interconnect Structure.” IMAPSource Proceedings 2010 (1): 197–203. https://doi.org/10.4071/isom-2010-TP2-Paper1.