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Symposium Proceedings
Vol. 2020, Issue 1, 2020
September 01, 2020 EDT
Two-Layer Solder Resist Film with Low Young’s Modulus for High Reliability
YingHsuan Chou
,
Daichi Okamoto
,
Hidekazu Miyabe
,
two-layer solder resist film
low young’s modulus
reliability
crack resistance
resolution
high-density substrate
•
https://doi.org/10.4071/2380-4505-2020.1.000307
IMAPSource Conference Papers
Chou, YingHsuan, Daichi Okamoto, and Hidekazu Miyabe. 2020. “Two-Layer Solder Resist Film with Low Young’s Modulus for High Reliability.”
IMAPSource Proceedings
2020 (1): 307–12.
https://doi.org/10.4071/2380-4505-2020.1.000307
.
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