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Symposium Proceedings
Vol. 2020, Issue 1, 2020September 01, 2020 EDT

Two-Layer Solder Resist Film with Low Young’s Modulus for High Reliability

YingHsuan Chou, Daichi Okamoto, Hidekazu Miyabe,
two-layer solder resist filmlow young’s modulusreliabilitycrack resistanceresolutionhigh-density substrate
https://doi.org/10.4071/2380-4505-2020.1.000307
IMAPSource Conference Papers
Chou, YingHsuan, Daichi Okamoto, and Hidekazu Miyabe. 2020. “Two-Layer Solder Resist Film with Low Young’s Modulus for High Reliability.” IMAPSource Proceedings 2020 (1): 307–12. https:/​/​doi.org/​10.4071/​2380-4505-2020.1.000307.
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