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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-Package

Rajesh Katkar, Rey Co, Wael Zohni,
Bond Via ArrayPackage on PackageStackingWide IOHigh BandwidthMobile
https://doi.org/10.4071/isom-TA15
IMAPSource Conference Papers
Katkar, Rajesh, Rey Co, and Wael Zohni. 2014. “Manufacturing Readiness of BVATM Technology for Fine-Pitch Package-on-Package.” IMAPSource Proceedings 2014 (1): 24–30. https:/​/​doi.org/​10.4071/​isom-TA15.

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