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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
Manufacturing Readiness of BVA™ Technology for Fine-Pitch Package-on-Package
Rajesh Katkar
,
Rey Co
,
Wael Zohni
,
Bond Via Array
Package on Package
Stacking
Wide IO
High Bandwidth
Mobile
•
https://doi.org/10.4071/isom-TA15
IMAPSource Conference Papers
Katkar, Rajesh, Rey Co, and Wael Zohni. 2014. “Manufacturing Readiness of BVA
TM
Technology for Fine-Pitch Package-on-Package.”
IMAPSource Proceedings
2014 (1): 24–30.
https://doi.org/10.4071/isom-TA15
.
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