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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Analysis of 16 QFN Device I/O Pads for Solderability Failures
Rama Hegde
,
Anne Anderson
,
Sam Subramanian
,
Andrew Mawer
,
Ed Hall
,
VK Leong
,
A. Selvakumar
,
Quad Flat No Leads (QFN)
Solderability
Surface roughness
Electro chemical polishing (ECP)
Paynter chart
NiPdAu
Failure Analysis
•
https://doi.org/10.4071/isom-2015-THA53
IMAPSource Conference Papers
Hegde, Rama, Anne Anderson, Sam Subramanian, Andrew Mawer, Ed Hall, VK Leong, and A. Selvakumar. 2015. “Analysis of 16 QFN Device I/O Pads for Solderability Failures.”
IMAPSource Proceedings
2015 (1): 675–84.
https://doi.org/10.4071/isom-2015-THA53
.
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