Analysis of 16 QFN Device I/O Pads for Solderability Failures

Rama Hegde; Anne Anderson; Sam Subramanian; Andrew Mawer; Ed Hall; VK Leong; A. Selvakumar

doi:10.4071/isom-2015-THA53

Hegde, Rama, Anne Anderson, Sam Subramanian, Andrew Mawer, Ed Hall, VK Leong, and A. Selvakumar. 2015. “Analysis of 16 QFN Device I/O Pads for Solderability Failures.” IMAPSource Proceedings 2015 (1): 675–84. https://doi.org/10.4071/isom-2015-THA53.

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Analysis of 16 QFN Device I/O Pads for Solderability Failures

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