Effect of preformed IMC Layer on Electromigration of Solder Capped Cu Pillar Bump Interconnection on an organic substrate

Yasumitsu Orii; Kazushige Toriyama; Sayuri Kohara; Hirokazu Noma; Keishi Okamoto; Keisuke Uenishi

doi:10.4071/isom-2012-TP61

Orii, Yasumitsu, Kazushige Toriyama, Sayuri Kohara, Hirokazu Noma, Keishi Okamoto, and Keisuke Uenishi. 2012. “Effect of Preformed IMC Layer on Electromigration of Solder Capped Cu Pillar Bump Interconnection on an Organic Substrate.” IMAPSource Proceedings 2012 (1): 455–63. https://doi.org/10.4071/isom-2012-TP61.

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