Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications
Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications
Ravichandran, Siddharth, Shuhei Yamada, Tomonori Ogawa, Tailong Shi, Fuhan Liu, Vanessa Smet, Venky Sundaram, and Rao Tummala. 2018. “Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications.” IMAPSource Proceedings 2018 (1): 331–36. https://doi.org/10.4071/2380-4505-2018.1.000331.