Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications

Siddharth Ravichandran, Shuhei Yamada, Tomonori Ogawa, Tailong Shi, Fuhan Liu, Vanessa Smet, Venky Sundaram, Rao Tummala,
Embedding Glass Panel Embedding 3D SiP Heterogeneous Integration
• https://doi.org/10.4071/2380-4505-2018.1.000331
IMAPSource Conference Papers
Ravichandran, Siddharth, Shuhei Yamada, Tomonori Ogawa, Tailong Shi, Fuhan Liu, Vanessa Smet, Venky Sundaram, and Rao Tummala. 2018. “Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications.” IMAPSource Proceedings 2018 (1): 331–36. https://doi.org/10.4071/2380-4505-2018.1.000331.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system