Next Generation Chip Embedding Technology for High Efficient Mid Power Modules

Kay S. Essig; CT Chiu; Jarris Kuo; Phidia Chen; Jean-Marc Yannou

doi:10.4071/isom-2017-THP34_153

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Essig, Kay S., CT Chiu, Jarris Kuo, Phidia Chen, and Jean-Marc Yannou. 2017. “Next Generation Chip Embedding Technology for High Efficient Mid Power Modules.” IMAPSource Proceedings 2017 (1): 737–41. https://doi.org/10.4071/isom-2017-THP34_153.

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