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Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
How Silver Powder Metallurgy Affects the Physical Properties of Low Temperature Firing Silver Conductor
Samson Shahbazi
,
Mark Challingsworth
,
Thick film
Lead free solder
Tin Lead Silver solder
Silver Conductor
•
https://doi.org/10.4071/isom-2011-TA3-Paper4
IMAPSource Conference Papers
Shahbazi, Samson, and Mark Challingsworth. 2011. “How Silver Powder Metallurgy Affects the Physical Properties of Low Temperature Firing Silver Conductor.”
IMAPSource Proceedings
2011 (1): 99–106.
https://doi.org/10.4071/isom-2011-TA3-Paper4
.
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